Lian Li Successfully Hosts 2026 Annual Meeting
2026年02月01日
Driving the Future of Computing with Liquid Cooling Innovation
January 31, 2026, Lian Li successfully hosted its 2026 Annual Meeting at the company’s headquarters. Bringing together the executive leadership team, core engineering experts, and representatives from across the organization, the event reviewed key achievements from 2025 and outlined the company’s strategic vision for the next phase of growth in high-performance and sustainable computing infrastructure.
In his opening remarks, the Chairman of Lian Li emphasized that the rapid expansion of artificial intelligence, large-scale model training, and high-performance computing (HPC) is fundamentally reshaping data center design. As computing power density continues to rise, traditional air-cooling solutions are increasingly constrained by efficiency and scalability limitations. Liquid cooling has emerged as a critical enabler for next-generation computing infrastructure, offering superior thermal efficiency, lower energy consumption, and improved sustainability.
Throughout 2025, Lian Li made significant progress in the liquid cooling market. The company continued to expand its portfolio of liquid-cooled computing solutions, covering server-level liquid cooling, rack-level systems, and modular liquid-cooled data center solutions. These technologies have been successfully deployed in multiple high-density computing projects, delivering measurable improvements in PUE, system stability, and overall operational efficiency, while helping customers reduce total cost of ownership (TCO).
At the meeting, Lian Li’s management team presented the company’s strategic roadmap for 2026. Building on its core strategy of “High-Efficiency Computing × Liquid Cooling × Sustainable Energy,” Lian Li will further increase investment in cold plate and immersion liquid cooling technologies, high-power computing hardware, and liquid-cooled modular data center platforms designed for AI and ultra-high-density workloads. In parallel, the company will accelerate its global expansion, strengthening overseas delivery capabilities and localized service networks to support the growing international demand for liquid-cooled computing infrastructure.
The annual meeting also included an awards ceremony recognizing outstanding teams and individuals for excellence in liquid cooling innovation, product development, large-scale project delivery, and market expansion. These achievements reflect Lian Li’s strong engineering capabilities and its long-term commitment to advancing liquid cooling as a mainstream solution for modern data centers.
The successful conclusion of the 2026 Annual Meeting highlights Lian Li’s clear strategic direction and confidence in the future. Looking ahead, Lian Li remains committed to driving innovation through liquid cooling, working closely with global partners to build more efficient, greener, and smarter computing infrastructure, and to create long-term value for the global digital economy.
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Explore the 2026 shift toward liquid cooling in AI data centers, including rising GPU power, the limits of air cooling, direct-to-chip and immersion cooling, and the role of liquid cooling in high-density thermal management and data-center energy efficiency.
Shenzhen Lianli will exhibit at Tech Week Singapore and Data Centre World Asia 2026, showcasing AI data center liquid cooling, CDUs, and next-generation thermal management solutions at Booth Y26.