Lianli Exhibition Invitation | The 20th Beijing International Data Center Exhibition (2026)

Join Lian Li at Booth M20 – A Must-Visit for Data Center Professionals

As the AI computing boom drives chip TDP to unprecedented levels, liquid cooling has become essential for high-density data centers. From May 14 to 16, 2026, the 20th Beijing International Data Center Expo will take place at the China International Exhibition Center (Chaoyang Hall), Beijing. This event is a premier platform for the global data center and smart computing industry.

Shenzhen Lian Li  Liquid Cooling Equipment Technology Co., Ltd. will showcase its complete liquid cooling solutions at Booth M20. We sincerely invite industry peers, partners, and experts to visit us and explore how liquid cooling technology can empower future computing infrastructure.

Lian Li Liquid Cooling: Driving Innovation in the AI Era

With AI computing power soaring, traditional air cooling struggles with thermal efficiency and energy consumption. Liquid cooling has become a "must-have" solution, capable of driving PUE below 1.1 and significantly reducing operational costs.

Shenzhen Lian Li Liquid Cooling Equipment Technology Co., Ltd. is a high-tech enterprise dedicated to the R&D and production of liquid cooling thermal solutions. We serve cloud data centers, server racks, communication equipment, energy storage stations, and industrial environmental control systems.

Key Achievements:

• Achieves PUE below 1.05 in real-world deployments
• Delivers over 40% energy savings, drastically cutting operational costs
• Solutions deployed in 100+ countries and regions
• Over 5 million units of cooling equipment installed
• Total project power capacity exceeding 10GW
• Certified with RoHS, CE, UL, CCS, and dozens of proprietary patents

Lian Li also meets strict international standards (ASHRAE/UL) and has served hyperscale data center customers 

Product Highlights: Liquid-Cooled Containers and Intelligent Thermal Control Systems
Focusing on AI training and high-density computing scenarios, Lian Li will prominently showcase a series of core products and innovative technologies:

• 20-foot / 40-foot Liquid-Cooled Data Center Containers: A high-density, rapidly deployable infrastructure solution. By integrating advanced liquid cooling technology into standard ISO shipping containers, this solution achieves exceptional thermal dissipation performance, energy efficiency, and scalability within a compact footprint.
• Data Center CDUs (Coolant Distribution Units): Custom-designed for large-scale data centers, these units enable precise flow control and hot/cold aisle isolation. Available in both rack-mounted and cabinet-style configurations, they meet customer requirements for flexible deployment—ranging from a single cabinet to an entire facility.
• 48U Air-To-Liquid Cooled Server Cabinets: Featuring a revolutionary dual-mode cooling architecture, these cabinets utilize an intelligently switching liquid cooling module (supporting both single-phase immersion and cold-plate cooling) for efficient heat extraction. Simultaneously, a redundant EC fan wall ensures uniform air-cooling coverage for loads of 35kW to 55kW, achieving a total cooling capacity of 50kW per cabinet. This design reduces the PUE to below 1.15 and cuts cooling-related electricity costs by 50%.

The scope of liquid cooling technologies and products showcased at this exhibition encompasses a comprehensive range of green, low-carbon infrastructure components, including cold-plate cooling, immersion cooling, CDUs (Coolant Distribution Units), and more. Lian Li’s end-to-end, in-house design and manufacturing capabilities significantly shorten project delivery cycles and reduce the total cost of ownership for customers, providing a robust technical foundation for the large-scale deployment of intelligent computing centers.

Meet Us in Beijing – Booth M20, China International Exhibition Center

We look forward to welcoming you at Booth M20 to experience our liquid cooling systems firsthand. This is an excellent opportunity to discuss collaboration, explore technical innovations, and drive the zero‑carbon transformation of data centers together.

• Expo Dates: May 14–16, 2026
• Venue: China International Exhibition Center (Chaoyang Hall)
• Address: No.6, North Third Ring Road East, Chaoyang District, Beijing, China
• Booth Number: M20

Join us at this 20th anniversary industry gathering – a place where global leaders, technical experts, and partners come together to shape the future of AI‑powered liquid cooling, computing‑energy synergy, and sustainable data centers.

We look forward to seeing you in Beijing. Let Lian Li Liquid Cooling build a green, high‑performance computing future with you.

Shenzhen ChainForce Liquid Cooling Equipment Technology Co., Ltd.

Website: https://lianliwork.com/

Dedicated to Liquid Cooling – Empowering Computing – Mastering High‑Density Futures

— Official release by ChainForce. For more expo updates, please visit our website.