At 9:00 AM on June 3, the 12th Shanghai International Data Center Industry Exhibition (CDCC 2026) officially opened at the Shanghai New International Expo Centre.

As a leading provider of liquid cooling infrastructure solutions, Lian Li made a strong appearance at Booth N5-509, showcasing its comprehensive portfolio of liquid cooling technologies designed for AI computing, intelligent computing centers, and next-generation data centers.

 

From the moment the exhibition opened, Lian Li's booth became one of the busiest destinations in Hall N5. Industry professionals, system integrators, data center operators, AI server manufacturers, and international buyers gathered to explore the company's latest innovations in high-density cooling and energy-efficient computing infrastructure.

 

Crowds Gather Before the Doors Open

At 8:30 AM, while the Lian Li engineering team completed final equipment inspections and demonstrations, visitors were already waiting outside the booth.

As the exhibition officially began, a steady stream of attendees entered the display area, creating an energetic atmosphere that continued throughout the day. Technical discussions, project consultations, and product demonstrations took place non-stop, reflecting the growing market demand for liquid cooling solutions amid the rapid expansion of AI computing power.

 

 

Day 1 Product Highlights: Three Flagship Liquid Cooling Solutions

 

8-GPU RTX 5090 Server Air-to-Liquid Cooling Retrofit Solution

The Most Discussed Product at the Exhibition

One of the major attractions at the Lian Li booth was the live demonstration of its 8-card RTX 5090 server air-to-cold-plate liquid cooling conversion solution.

 

Key Advantages

Converts traditional air-cooled GPU servers into efficient cold-plate liquid-cooled systems.

Reduces GPU core temperatures by approximately 18–20°C under high-load conditions.

Lowers operating noise by up to 25 dB.

Ensures stable full-performance operation for 8-GPU AI training and inference workloads.

Maintains the original server chassis, significantly reducing retrofit costs and deployment time.

Visitors were able to compare the server before and after conversion, while Lian Li engineers presented detailed thermal testing data and deployment results. The solution quickly became one of the most frequently discussed products at the entire exhibition.

 

4U 65kW In-Rack CDU

High Cooling Capacity in a Compact Form Factor

Lian Li's proven 4U 65kW Coolant Distribution Unit (CDU) attracted strong interest from intelligent computing center operators and international project contractors.

 

Product Features

Compact 4U rack-mounted design.

Up to 65kW cooling capacity.

Fully redundant pump architecture.

Designed for continuous 24/7 mission-critical operation.

Successfully deployed across multiple large-scale liquid cooling projects.

The product's mature design and reliability prompted many visitors to schedule follow-up technical meetings after the exhibition.

 

 

4U 8kW Liquid-to-Air CDU

The Ideal Entry Point for Liquid Cooling Adoption

For organizations planning their first liquid cooling deployment, the 4U 8kW  Liquid-to-Air CDU emerged as a highly attractive option.

 

Key Benefits

Dual-mode architecture integrating both air cooling and liquid cooling.

8kW cooling capacity optimized for edge computing and small server environments.

Plug-and-play deployment.

No external cooling tower or outdoor cooling source required.

Cost-effective solution for phased infrastructure upgrades.

This flexible design generated significant interest from operators of small and medium-sized data centers, enterprise server rooms, and edge computing facilities seeking a smooth transition toward liquid cooling technologies.

 

 

Featured AI Infrastructure Cases:

GB200 Liquid-Cooled Container & GB300 Liquid Cooling Architecture

While the physical systems were not displayed on-site, Lian Li presented comprehensive case studies covering two of the industry's most discussed AI infrastructure topics:

 

GB200 Liquid-Cooled Container Deployment

Using real-world project experience, Lian Li engineers demonstrated how a 20-foot liquid-cooled data centet container can support three full NVIDIA GB200 racks while maintaining:

High-density thermal management

Stable system operation

PUE below 1.15

Rapid deployment capability

The presentation highlighted practical deployment strategies for AI computing clusters operating in demanding environments.

 

GB300 Liquid Cooling Architecture

As GPU power consumption and rack densities continue to increase, Lian Li also shared its latest research and development progress surrounding next-generation GB300 liquid cooling architectures.

 

Topics included:

Cold-plate liquid cooling design methodologies

System-level compatibility planning

CDU and rack integration strategies

Future-ready cooling infrastructure for ultra-high-density AI clusters

The presentations attracted extensive attention from AI server manufacturers, intelligent computing center planners, and international data center developers.

Many attendees scheduled dedicated follow-up technical discussions directly at the booth.

 

 

Booth N5-509 Remained Busy from Morning to Evening

Throughout the first day, Lian Li's booth maintained a constant flow of visitors.

Technical consultations, project evaluations, and solution discussions continued from opening until closing, with many guests waiting in line for one-on-one discussions with the engineering team.

 

The overwhelming interest further demonstrates the industry's accelerating transition toward liquid cooling technologies as AI workloads continue to push the limits of traditional air-cooling systems.

 

 

Join Us on June 4–5

Missed Day 1? There is still time to visit us.

The Lian Li technical team will remain available throughout the exhibition at Booth N5-509 to provide:

Full product demonstrations of Lian Li liquid cooling solutions

Air-to-liquid cooling retrofit consultation services

Customized liquid cooling system design support

Factory-built liquid cooling module introductions

GB200 and GB300 deployment case study sharing

Technical documentation and engineering consultation

 

We look forward to meeting industry partners, customers, and innovators as we work together to build the next generation of sustainable, high-performance computing infrastructure.

Location: Shanghai New International Expo Centre
Booth: N5-509
Dates: June 3–5, 2026

See you at Booth N5-509.