Lian LI Cordially Invites You to Visit the Shenzhen AI Data Center Liquid Cooling Exhibition

As large-scale AI models enter the era of trillion-parameter scales, power density per cabinet is surging toward the hundred-kilowatt—and even megawatt—range. With traditional air-cooling technologies having reached their physical limits, liquid cooling is rapidly transitioning from a mere "option" to an "essential requirement" for data center infrastructure. According to data from TrendForce, the adoption rate of liquid cooling in AI data centers stood at 14% in 2024 and is projected to rise to 40% by 2026. 

During this critical window—marked by the accelerated deployment of liquid cooling technologies—Lian LI will make a grand appearance at the 3rd International AI Data Center Liquid Cooling & Thermal Management Supply Chain Summit and Exhibition. Showcasing its full-stack liquid cooling product portfolio and cutting-edge technical solutions, Lian LI looks forward to engaging with industry peers to discuss the transformative pathways for thermal management in the era of high-performance AI computing.

Summit Overview

Hosted by Wenyiao Thermal Design and co-organized by Shanghai Jiao Tong University, this summit is scheduled to take place on May 21–22, 2026, at the Hyatt Regency Shenzhen Airport (1st Floor/L Level). With an anticipated attendance of over 1,000 participants, the conference will bring together industry leaders, technical experts, and representatives from more than a hundred upstream and downstream enterprises across the fields of AI data centers, liquid cooling solutions, and new energy thermal management. The event will feature in-depth discussions centered on cutting-edge topics, including liquid cooling technologies for ultra-density data centers, ultra-node data center architectures, advancements in cold-plate and immersion liquid cooling, the development of data center CDUs and liquid cooling components, and high-power thermal packaging technologies for chips.

Running concurrently with the summit, a series of multi-faceted activities—including exhibitions, technical workshops, and industry matchmaking sessions—will be held. Furthermore, over 60 keynote presentations will comprehensively showcase the latest breakthroughs and industrialization pathways in liquid cooling technology.

Lian Li Exhibition Highlights

As a global leader in liquid cooling solutions, Lian Li has provided customized liquid cooling systems and comprehensive implementation support to over 100 countries and regions worldwide. To date, the company has cumulatively deployed more than 5 million liquid cooling units, supporting projects with a total power capacity exceeding 10GW. By successfully driving PUE values ​​down to below 1.05, Lian Li has helped clients achieve exceptional energy savings of over 40%. These achievements were highlighted at the recently concluded "2026 Yunfan: 5th Data Center & AI Liquid Cooling Supply Chain Summit," attended by over a thousand industry professionals.

At this Shenzhen summit, Lian Li will once again showcase its full lineup of cutting-edge, innovative products, with a particular focus on the following core solutions:
40-Foot Liquid-Cooled Data Center Container: An advanced, prefabricated, and mobile data center solution designed for rapid and efficient deployment. It is compatible with the full range of NVIDIA AI servers—including the GB300, GB200, B300, B200, and H200 series—ensuring stable operation under high-density computing conditions.

500kW Rack-Mounted CDU: A high-power cooling distribution unit (CDU) designed for large-scale AI data centers. It supports continuous, 24/7 stable operation, is compatible with various cooling media, and offers flexible customization options to meet the specific requirements of diverse scenarios.

Rack-Mounted CDU Series: This comprehensive series encompasses various models—including the 4U 65kW unit, rack-mounted liquid-to-liquid CDUs, and rack-mounted air-to-liquid CDUs. Featuring automatic failover switching for cooling loops, these units are compatible with all mainstream platforms from NVIDIA, Intel, and AMD, providing flexible and efficient cooling solutions for small to medium-sized data centers and AI computing environments of varying scales.

Core Advantages of Chainli’s Solutions

Lian Li is dedicated to providing clients with fully integrated liquid cooling services that span the entire lifecycle—from solution design to on-site deployment. Our core strengths include complete cabinet delivery, site-agnostic adaptability, robust redundancy and reliability, and comprehensive functionality.
The company has established a complete, full-stack liquid cooling solution ecosystem encompassing liquid cooling cold plates, CDUs, containerized data centers, and fully liquid-cooled cabinets. We possess extensive experience in the liquid cooling retrofitting and adaptation of mainstream platforms from NVIDIA, AMD, and Intel.

Event Guide:
Dates: May 21–22, 2026
Venue: Hyatt Regency Shenzhen Airport — 1st Floor (L Level) | (Located west of Terminal 3, Hourui Community, Hangcheng Subdistrict, Bao'an District, Shenzhen, Guangdong Province)
Registration Hours: May 20 (18:30–20:00); May 21 (08:00–08:50)

We look forward to meeting you in Shenzhen to jointly usher in a new era of thermal management for AI computing power!