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Azerbaijan ORV3-RACK-440U OCP Open Rack V3 Liquid Cooling Ready Rack

ORV3-RACK-440U OCP Open Rack V3 liquid cooling ready rack. 440U high density, 48V bus bar, DLC-ready for AI data center and HPC clusters.

Category:

AzerbaijanProudcts

AzerbaijanLiquid Cooled Server Cabinet

AzerbaijanData Center Liquid Cooling System

Phone:+86-400-852-9767

Product Description

The ORV3-RACK-440U is an OCP-certified Open Rack V3 liquid cooling ready rack built for high-power AI, HPC and dense data center deployments. Featuring a 21-inch inner width, 440U mounting space and pre-reserved CDU installation area, this rack supports rack-level direct liquid cooling. It adopts 48V Bus Bar power architecture and natively fits ORV3 hardware, while remaining compatible with traditional 19-inch EIA devices via adapter frames.

Specifications Table

Item

Details

Product Model

ORV3-RACK-440U

Standard Compliance

OCP Open Rack V3 Base Spec, OCP Certified

Total Usable Height

440U (2112mm, 48mm per OU)

Internal Mount Width

21 inch

Rack Depth

1200 mm

Supported Equipment

Native ORV3 IT hardware; 19-inch EIA equipment (with adapter frame)

Power System

48V DC Bus Bar, rated 30kW, support hot-swappable Power Shelf

Liquid Cooling

DLC-Ready, reserved CDU & liquid pipeline space

Application Scenarios

AI data center, HPC / supercomputing center, high-density colocation


 Applications

AI Data Centers

Designed for high-density AI computing environments, supporting the deployment of AI servers and GPU clusters.

GPU Computing Clusters

Suitable for high-power GPU servers and large-scale computing clusters requiring efficient power and cooling infrastructure.

High-Performance Computing (HPC)

Supports high-density server deployment for scientific computing, engineering simulations, and other HPC applications.

High-Density Data Centers

Ideal for modern data centers requiring high-density computing, centralized power distribution, and integrated liquid cooling solutions.

 

FAQ


Q1: What is an OCP ORV3.0 Liquid-Cooled Server Rack?

The OCP ORV3.0 Liquid-Cooled Server Rack is an open rack designed based on the OCP Open Rack V3 standard. Featuring a 21-inch architecture and 44U configuration, it is designed for AI servers, GPU clusters, and high-density computing applications.

Q2: What applications is this server rack suitable for?

This rack is suitable for AI data centers, GPU computing clusters, high-performance computing (HPC), and other high-density computing environments.

Q3: Does the rack support liquid cooling systems?

Yes. Depending on project requirements, the rack can be configured with liquid cooling components such as CDUs and manifolds and can be integrated into a complete liquid cooling system.

Q4: What are the advantages of the 48V Busbar power system?

The 48V Busbar system provides centralized power distribution, helping reduce complex internal cabling and supporting the power requirements of high-density servers and AI computing equipment.

Q5: Is the OCP ORV3.0 rack suitable for AI and GPU servers?

Yes. The open rack architecture is designed to support high-density computing environments, including AI servers, GPU clusters, and HPC systems. Configurations can be customized according to server specifications and project requirements.

Q6: Is customization available?

Yes. The rack can be configured according to customer requirements, including server deployment, power distribution, liquid cooling components, and other project-specific configurations.


Related Products


Build a Complete Data Center Liquid Cooling System

The OCP ORV3.0 Liquid-Cooled Server Rack can be integrated with related liquid cooling equipment to support complete cooling solutions for AI data centers and high-density computing environments.

 

Rack-Mounted CDU

Provides coolant circulation and thermal management for rack-level liquid cooling systems.

Cabinet CDU

Designed for higher-capacity liquid cooling systems, providing centralized coolant distribution and thermal management.

Cold Plate

Designed for direct liquid cooling of high-power components such as CPUs and GPUs, providing efficient chip-level thermal management.

 

Shipping & Delivery


Professional Packaging

Products are securely packaged to help protect equipment during transportation. Packaging solutions can be selected according to product specifications and shipping requirements.

Flexible Shipping Options

We support multiple international shipping methods, including sea freight, air freight, and other logistics solutions based on project requirements and destination.

Global Delivery Support

We provide shipping support for customers worldwide and can coordinate suitable logistics arrangements according to the destination and project schedule.

Project-Based Delivery

Delivery schedules are determined based on product configuration, order quantity, production requirements, and destination. Please contact our team for detailed delivery information.

 

Need Shipping Information for Your Project?

Contact our team for product packaging, shipping options, and delivery schedule information.

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