The head of Lian Li will be speaking at the 4th Data Center Liquid Cooling

With the rapid growth of artificial intelligence, large-scale models, and high-performance computing, data centers are entering a new era characterized by ultra-high power density and increasing demands for energy efficiency. Liquid cooling, AI chip thermal management, and AIDC (AI Data Centers) have become critical focus areas across the global industry.

The 4th Data Center Liquid Cooling & AI Chip Thermal Management Supply Chain Summit 2026 will take place on January 14–15, 2026, at the Hyatt Regency Shenzhen Airport, Bao’an District, Shenzhen, China. The forum is organized by Yunfan Thermal Management, with DataPort serving as the guiding organization. The event aims to bring together the full value chain to explore cutting-edge technologies and future development paths.

In-Depth Focus on Liquid Cooling and AI Thermal Management

The summit will center on key challenges and opportunities driven by the rapid evolution of AI computing infrastructure. Core discussion topics include:

Innovation and future trends in data center and AI thermal management

Thermal design challenges of AI chips and the evolution of liquid cooling technologies

Cold plate liquid cooling and immersion cooling solutions for data centers

Design, development, and application experience of CDUs and liquid cooling components

Covered liquid cooling components include cold plates, liquid cooling pipelines, quick connectors, valves, pumps, and heat exchangers, with real-world deployment cases and engineering insights shared by industry experts.

Comprehensive Agenda: One Plenary Session and Six Parallel Forums

The conference will feature:

One main plenary session, focusing on industry outlook, policy direction, and breakthrough technologies

Six parallel technical forums, each dedicated to specialized application scenarios and technology tracks

The event is expected to host 70+ enterprises showcasing products and solutions, alongside over 1,600 industry experts, including data center operators, AI chip vendors, system integrators, and thermal management professionals.

Shenzhen Lian Li Company Makes A Grand Appearance

As an influential player in the liquid cooling data center sector, Shenzhen Lian Li  Liquid Cooling Technology Co., Ltd. will be represented by its Data Center Business Director, who will deliver a featured keynote speech titled:

“Blockchain-Empowered Liquid-Cooled Data Centers: Unlocking the AIDC Era”

The presentation will explore how blockchain technology can be integrated with liquid-cooled data center infrastructure, enabling enhanced security, reliability, energy efficiency, and operational transparency in next-generation AIDC deployments. The session will provide innovative perspectives and practical insights for the global data center industry.

Join Industry Leaders to Shape the Future of AIDC

Driven by carbon reduction goals and the explosive growth of AI workloads, liquid cooling is rapidly transitioning from an alternative option to a core data center infrastructure technology. This summit serves not only as a platform for technology exchange and product innovation, but also as a catalyst for collaboration across the global supply chain.

Industry professionals worldwide are warmly invited to join the event in Shenzhen,to share insights, explore partnerships, and collectively shape the future of AI-driven data centers.