Lian Li presents its liquid cooling solutions at the 4th Data Center Conference.
2026年01月16日
The 4th Data Center Liquid Cooling & AI Thermal Management Supply Chain Conference concluded successfully in Shenzhen, bringing together leading enterprises, data center operators, solution providers, and technology experts from across the global liquid cooling ecosystem. Lian Li was honored to participate in the conference and engage in in-depth discussions on the future of liquid cooling technologies for AI-driven data centers.
With the theme “Building a Liquid Cooling Ecosystem for Sustainable AIDC Development,” the conference focused on key challenges and innovations related to high-power-density computing, AI chip thermal management, and next-generation data center infrastructure.
Industry Leaders Gather to Explore Liquid Cooling Trends
During the conference, industry experts shared insights on direct-to-chip liquid cooling, immersion cooling, CDU system design, and thermal management solutions for AI and HPC workloads. The rapid growth of AI computing power and increasing rack densities have accelerated the industry’s transition from traditional air cooling to liquid cooling as a core infrastructure standard.
Participants widely agreed that liquid cooling is becoming essential for improving energy efficiency, reducing PUE, and supporting the sustainable development of modern data centers.
Lian Li Showcases Liquid Cooling Expertise
At the event, Lian Li actively engaged with industry peers and partners, sharing its practical experience in data center liquid cooling solutions and high-density thermal management. Through technical exchanges and discussions.Lian Li highlighted how liquid cooling technologies can effectively address the heat dissipation challenges of AI servers and next-generation computing infrastructure.
Lian Li’s participation reinforced its commitment to delivering reliable, scalable, and energy-efficient liquid cooling solutions for AI data centers and advanced computing environments.
Strengthening Collaboration Across the Supply Chain
Beyond technical presentations, the conference provided a valuable platform for networking and collaboration. Lian Li held productive discussions with data center operators, system integrators, and component suppliers, exploring potential cooperation opportunities across the liquid cooling supply chain.
These exchanges further strengthened industry partnerships and contributed to the advancement of standardized, large-scale deployment of liquid cooling technologies.
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Explore the 2026 shift toward liquid cooling in AI data centers, including rising GPU power, the limits of air cooling, direct-to-chip and immersion cooling, and the role of liquid cooling in high-density thermal management and data-center energy efficiency.
Shenzhen Lianli will exhibit at Tech Week Singapore and Data Centre World Asia 2026, showcasing AI data center liquid cooling, CDUs, and next-generation thermal management solutions at Booth Y26.
Shenzhen Lianli Liquid Cooling Technology Co., Ltd
E-mail: sales@lianliai.com
Tel：+86-18002936305
Headquarters Address: 12th Floor, Chaopinsan Technology Building, No.18 Gaoke Avenue, Longgang District, Shenzhen City, Guangdong Province, China
Factory Address: Unit 101, Building 15 (Ersha Shenlian), No. 6 Baolong Avenue, Baolong Community, Baolong Subdistrict, Longgang District
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