Exhibition in Progress | Lianli Liquid Cooling Makes Its Mark at LCIE 2026 Beijing

Focusing on High-Density AI Computing, Lianli Connects with Industry Partners on the Latest Liquid Cooling Trends

On September 15, LCIE 2026 — the 2nd International Liquid Cooling Industry Conference & Exhibition — officially opened at the China National Convention Center (Phase II) in Beijing.

As one of the major professional events for the liquid cooling industry in 2026, the exhibition focuses on data center applications, the full liquid-cooling value chain, intelligent computing centers, AI servers, internet and cloud computing, energy storage, and ultra-fast charging. The exhibition runs through September 16, from 9:00 a.m. to 5:00 p.m. each day.

On the opening day, Shenzhen Lianli Liquid Cooling Equipment Technology Co., Ltd. made its appearance at Booth F16, showcasing liquid cooling products and solutions for high-density data centers while engaging in technical discussions with industry visitors and partners.

Since the exhibition opened, the Lianli booth has continued to attract visitors from across the industry, with discussions focusing on liquid cooling equipment, server cabinets, and data center liquid cooling solutions.

01 | Lianli’s F16 Booth Draws Continued Attention

At LCIE 2026, Lianli’s F16 booth features a distinctive blue-and-white design, with physical displays of liquid cooling equipment, server cabinets, and liquid-cooled computing products. Digital displays at the booth also showcase data center facility and computing pod solutions.

Rather than relying solely on product images, Lianli has combined physical equipment, server rack hardware, and application-oriented solution displays, allowing visitors to gain a more direct understanding of how liquid cooling can be deployed in high-density computing environments.

As shown in the on-site photos, groups of visitors have been engaging in face-to-face discussions with the Lianli team, covering product architecture, application scenarios, and liquid cooling system design.

For a B2B company, this kind of direct interaction with the market is one of the most tangible values of an industry exhibition.

02 | Face-to-Face Industry Exchange: Liquid Cooling Is Moving from Individual Products to System-Level Integration

The Beijing exhibition brings together companies across the liquid cooling ecosystem, including liquid cooling equipment suppliers, key component manufacturers, server vendors, data center companies, and AI computing infrastructure providers.

At the exhibition, Lianli is also engaging with industry peers and companies across the broader ecosystem.

One clear industry shift is that liquid cooling can no longer be viewed simply as a standalone cooling device.

As AI server power and rack density continue to rise, liquid cooling increasingly needs to be designed in coordination with servers, racks, Coolant Distribution Units (CDUs), piping, power distribution, and other data center infrastructure.

LCIE 2026 itself focuses on the full liquid-cooling value chain and its applications across data centers, intelligent computing centers, AI servers, and other key scenarios — closely reflecting the direction in which the industry is evolving.

In other words, the industry is moving from:

“Which liquid cooling product delivers better thermal performance?”

toward a more practical question:

“How can the liquid cooling system actually be deployed in an AI data center?”

This has also emerged as an important topic throughout the technical and industry discussions taking place at the exhibition.

03 | Growing On-Site Interest: AI High-Density Computing Is Driving More Specific Liquid Cooling Requirements

Based on the discussions taking place at the booth, visitors are increasingly interested in liquid cooling beyond the technology itself, with greater attention being placed on real-world applications and deployment.

Why liquid cooling?

The answer is becoming increasingly clear.

As AI models continue to evolve, GPU computing density is increasing, while chip-level power consumption and rack-level power are also rising. This is placing greater thermal-management demands on traditional air-cooling systems.

According to TrendForce’s latest research released in August, liquid cooling penetration among AI chips is projected to reach 53% in 2026 and approach 60% in 2027. At the same time, high-end AI chips have already exceeded 1 kW of TDP per chip, while rack-level AI server power can reach several hundred kilowatts.

This helps explain why AI servers, high-density racks, CDUs, and liquid cooling systems have become important areas of focus at liquid cooling exhibitions this year.

The continued inquiries from visitors at the Beijing exhibition are also a direct reflection of this shift in real-world market demand.

04 | Beijing Media Spotlight: Lianli Draws Attention on the Exhibition Floor

During the exhibition, Beijing-based media visited the LCIE 2026 venue to report on the liquid cooling industry and participating companies.

Lianli’s booth, featuring physical liquid cooling equipment and high-density data center solutions, became one of the areas highlighted during the on-site coverage.

From product demonstrations to face-to-face technical discussions, the media coverage captured an important moment of Lianli’s participation in the Beijing liquid cooling industry event, while highlighting the company’s efforts in technology development and market deployment for AI computing infrastructure.

05 | Why Is Liquid Cooling Receiving So Much Attention This Year?

The strong attention surrounding LCIE 2026 in Beijing is not accidental.

At the end of August, CCTV Finance reported on the rapidly growing data center liquid cooling market, noting that the expansion of AI computing clusters and high-power servers is driving demand for liquid cooling.

The report noted that cold-plate liquid cooling remains one of the more mature and widely deployed approaches, while immersion cooling and other technologies are also being explored for higher-power-density applications as rack power continues to increase.

Entering September, industry attention has continued to shift toward next-generation AI infrastructure.

In June, NVIDIA published information on its liquid cooling technology showing that its latest AI servers can operate with coolant temperatures of up to 45°C, while describing its Rubin-generation AI infrastructure as a 100% liquid-cooled architecture.

These developments point to an important shift in the liquid cooling industry:

Liquid cooling is evolving from a technology primarily designed to address server heat dissipation into an increasingly important part of the infrastructure supporting next-generation AI computing.

06 | What the Beijing Exhibition Reveals: The Industry Is Focused on Deployment

The LCIE 2026 exhibition floor reflects a more practical and deployment-oriented phase for the liquid cooling industry.

Companies are no longer showcasing only individual cooling components, and customers are no longer simply asking:

“What is liquid cooling?”

More of the discussion is now centered on practical questions:

• How can liquid cooling be integrated with AI servers?
• How can rack density be increased while maintaining thermal performance?
• How should liquid cooling be planned for a new data center?
• How can existing data center facilities be retrofitted for liquid cooling?
• How can liquid cooling systems maintain reliable long-term operation?

Ultimately, these questions point to one central issue:

How can liquid cooling technology be deployed at scale?

This is also the direction Lianli continues to explore through product demonstrations, industry exchange, and direct communication with customers at LCIE 2026.

07 | The Exhibition Continues — Lianli’s F16 Booth Remains Open for Industry Exchange

LCIE 2026 in Beijing is still underway.

On the first day, September 15, Lianli engaged with visitors from the data center, AI computing, and liquid cooling sectors through product demonstrations and face-to-face discussions.

An exhibition is not an endpoint; it is an opportunity for direct interaction with the market, industry peers, and customers.

As the liquid cooling industry continues to evolve, the demand created by higher-power and higher-density AI computing is also changing. New server platforms, new liquid cooling architectures, and new data center deployment models will continue to bring new requirements to liquid cooling solution providers.

Lianli will continue to focus on liquid cooling products and integrated solutions for high-density data centers, advancing product development, manufacturing, and application practices to provide liquid cooling solutions better matched to the evolving needs of AI computing infrastructure.

LCIE 2026 · China National Convention Center (Phase II), Beijing

Lianli Liquid Cooling · Booth F16

September 15–16 · See you at the show.