Lianli Invited by Intel to Attend Intel Connection 2026, Exploring New Opportunities in AI Computing and Liquid Cooling

Shenzhen Lianli Liquid Cooling Technology Co., Ltd. has been invited by Intel China to attend Intel Connection 2026 and the 9th Intel Customer Solutions Forum, taking place at the Suzhou International Expo Centre from September 22 to 23, 2026.

Under the theme “Agentic AI Is Accelerating the Transformation of Industries and Everyday Life,” the event will focus on the industrial transformation and application opportunities driven by rapid advances in artificial intelligence. Discussions will cover intelligent computing, AI infrastructure, edge computing, edge devices, industrial digitalization, and ecosystem collaboration.

According to Intel’s official invitation, the event will bring together Intel industry teams, ecosystem partners, solution providers, and technology developers to explore emerging trends, achievements, and opportunities in intelligent computing. Through keynote presentations, the Customer Solutions Forum, and exhibitions showcasing technology applications, the event will further promote collaboration between technological innovation and industrial deployment.

For Lianli, which continues to focus on data center infrastructure and liquid cooling technology, this invitation reresents not only an opportunity to gain insight into the latest industry developments, but also an important platform for strengthening industry collaboration, understanding the evolving requirements of AI computing infrastructure, and exploring potential technology partnerships.

Agentic AI Drives New Requirements for Computing Infrastructure

In recent years, artificial intelligence has continued to move deeper into industrial applications. Technologies such as large AI models, agentic applications, high-performance computing, and edge intelligence are steadily expanding the boundaries of what is possible. AI is evolving beyond standalone model training and inference toward applications in enterprise operations, intelligent manufacturing, digital services, scientific research, and everyday life.

Against this backdrop, computing infrastructure is playing an increasingly critical supporting role.

As AI adoption expands, data volumes, computational complexity, and demand for computing capacity continue to grow. Data centers are therefore facing higher requirements for server performance, rack deployment, power delivery, cooling efficiency, and operational stability. This is particularly evident in high-performance GPU, AI accelerator, and high-density computing environments, where rising heat loads place greater thermal management demands on traditional air cooling in certain high-power applications.

As a result, data center operators must address how to maintain stable equipment operation while improving thermal management efficiency, optimizing infrastructure deployment, and accommodating the continued expansion of computing capacity.

Against this industry backdrop, liquid cooling is gradually emerging as an important technology direction for high-density computing infrastructure.

Liquid cooling transfers heat through a liquid medium. Compared with conventional air cooling, it offers the potential for improved heat removal in selected applications involving high heat flux and high-power equipment. Today, liquid cooling encompasses multiple technology and product pathways, including cold-plate cooling, liquid-cooled server racks, Coolant Distribution Units (CDUs), and system-level liquid cooling solutions.

As AI computing infrastructure continues to evolve, liquid cooling products are no longer viewed simply as standalone heat-removal equipment. They are increasingly integrated with server architecture, rack design, piping systems, control and management platforms, and the overall deployment of data center infrastructure.

Lianli Continues to Expand Its Liquid Cooling Portfolio to Support Data Center Infrastructure

As a company focused on the research, development, and manufacturing of liquid cooling products for data centers, Shenzhen Lianli Liquid Cooling Technology Co., Ltd. continues to strengthen its liquid cooling portfolio and manufacturing capabilities in response to data center thermal management requirements.

Lianli’s current products and solutions include:

Cabinet-type CDUs, rack-type CDUs, cold plates, liquid-cooled server racks, and containerized data centers.

These products address different application requirements, including coolant circulation and distribution, chip-level heat transfer, server rack cooling, and complete data center deployment. Depending on project requirements, they can be combined into tailored product packages and system-level solutions.

As a critical component of a liquid cooling system, a CDU can connect the equipment-side cooling loop with the facility-side cooling system, providing the circulation and thermal management support required for liquid-cooled equipment. Cold plates, meanwhile, are designed primarily to transfer heat away from chips and other heat-generating components. When properly integrated with the server platform, they enable more targeted and application-specific cooling designs.

Products such as liquid-cooled server racks and containerized data centers further extend into equipment integration, rack deployment, and data center applications, giving customers options ranging from individual products to complete application solutions.

For liquid cooling manufacturers, industry competitiveness is determined not only by the products themselves, but also by capabilities in R&D and design, manufacturing, quality testing, system integration, delivery, and after-sales support.

Lianli continues to focus on the relationship between product performance, manufacturing processes, and project requirements. Through in-house R&D, precision manufacturing, and rigorous testing, the company continues to improve product reliability and application compatibility, providing liquid cooling product support for data center customers across different regions and application types.

Industry Ecosystem Engagement to Strengthen Technology–Application Collaboration

The development of AI computing infrastructure depends on coordinated efforts across multiple areas, including chips, servers, networking equipment, power distribution, cooling systems, and data center construction.

Within this value chain, liquid cooling technology is closely connected to the computing platform. Server power density, chip thermal design, rack structure, coolant loops, and data center infrastructure conditions can all influence the design and deployment of a liquid cooling system.

Liquid cooling companies must therefore keep track of the technological evolution of computing platforms and their real-world application requirements, rather than focusing only on a particular cooling device or product category.

Intel has long been involved in advancing computing technologies and building industry ecosystems. Its engagement activities for partners, customers, and industry developers provide companies across the value chain with channels for understanding technology directions and application requirements.

Through its participation in Intel Connection 2026, Lianli will explore topics related to agentic AI, AI infrastructure, and industry ecosystems, while gaining further insight into how advances in computing technology are changing infrastructure requirements and actively engaging in industry discussions.

By communicating with companies across the industry value chain, Lianli aims to deepen its understanding of different application scenarios, equipment compatibility requirements, and system deployment approaches. The company will continue refining its liquid cooling products and solutions to provide better-matched product support for future data center projects.

It is important to recognize that the effectiveness of a liquid cooling system is closely linked to its overall design, equipment configuration, operating conditions, and project implementation approach. The future development of liquid cooling must therefore consider not only cooling efficiency, but also practical factors such as system reliability, operations and maintenance, energy utilization, and project delivery.

Lianli will continue to put customer requirements at the center of its efforts, strengthen its product R&D and manufacturing capabilities, closely follow industry technology developments, and build practical experience in product applications and system delivery through real-world projects.

Event Date and Venue

According to Intel’s event invitation, the key details are as follows:

Intel Technology Innovation and Industry Ecosystem Conference

Event: Intel Technology Innovation and Industry Ecosystem Conference (Intel Connection 2026) and the 9th Intel Customer Solutions Forum

Date: September 22–23, 2026

Venue: Suzhou International Expo Centre

Address: No. 688, Suzhou Avenue East, Suzhou Industrial Park, Suzhou, Jiangsu Province, China

See You in Suzhou on September 22 — Lianli Looks Forward to Meaningful Discussions with Industry Partners

Tomorrow, Shenzhen Lianli Liquid Cooling Technology Co., Ltd. will travel to the Suzhou International Expo Centre to attend Intel’s 2026 Technology Innovation and Industry Ecosystem Conference.

Lianli’s participation reflects its continued attention to developments in AI computing, data center infrastructure, and liquid cooling technology. As artificial intelligence and high-performance computing continue to evolve, Lianli will further strengthen its capabilities in product R&D, manufacturing, quality testing, and system delivery, while actively engaging in industry collaboration and exchange.

Looking ahead, Lianli will continue exploring more stable, efficient, and application-adaptable products and solutions for data center liquid cooling, supporting the broader adoption of liquid cooling technology in high-density computing, AI data centers, and other emerging computing infrastructure environments.

Through this event, we look forward to engaging in in-depth discussions with Intel and industry partners, learning about cutting-edge technology trends, sharing practical industry experience, and jointly exploring emerging requirements and opportunities in AI computing infrastructure development.

With liquid cooling technology at the core and product quality and delivery capabilities as the foundation, Lianli will continue working with industry partners to advance data center infrastructure toward greater efficiency, reliability, and sustainability.