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AI Computing Power Is Driving a New Era of Data Center Cooling | Lianli Invites You to Tech Week Singapore 2026

2026年09月29日

As generative AI, high-performance computing (HPC), and cloud computing continue to advance, data centers are evolving toward higher power and compute densities. The rapid expansion of GPU clusters is placing increasing demands on thermal management, energy efficiency, and system reliability. Liquid cooling is becoming an increasingly important component of next-generation data center infrastructure.

On September 29–30, 2026, Tech Week Singapore 2026 will take place at Marina Bay Sands Expo and Convention Centre in Singapore. Shenzhen Lianli Liquid Cooling Equipment TechnologyCo., Ltd. will exhibit at Data Centre World Asia 2026, held as part of the event, at Booth Y26, showcasing liquid cooling products and solutions designed for high-density data centers and AI infrastructure.

1. Growing AI Computing Demands Present New Cooling Challenges

With the widespread adoption of AI servers and GPU clusters, traditional air-cooling architectures are facing increasing challenges in high-power-density environments. Rising rack heat loads, more complex hotspot management, cooling energy consumption, and space utilization are becoming critical considerations in data center construction and modernization.

For AI data centers, thermal management is no longer simply a matter of individual equipment performance. It requires a coordinated system encompassing liquid-cooled server racks, cold plates, Coolant Distribution Units (CDUs), piping networks, control systems, and safety protection mechanisms.

At the same time, data center operators must balance energy efficiency, system redundancy, operational reliability, and future scalability. Delivering effective heat dissipation while maintaining stable operation and flexible deployment for high-density computing has become a key industry priority.

2. Singapore Accelerates the Adoption of Liquid Cooling Infrastructure

Singapore is a major data center hub in the Asia-Pacific region. Growing AI computing demands and ongoing infrastructure upgrades are driving increased interest in liquid cooling technologies across the local market.

In August 2026, Singapore released Liquid Cooling in Tropical Data Centers, providing dedicated technical guidance for liquid cooling applications in tropical climates. The publication reflects growing attention to the design and operation of liquid cooling systems in high-temperature and high-humidity environments.

In terms of real-world deployment, Nxera, Singtel's data center business, has brought its DC Tuas data center into operation. With 58 MW of AI-ready capacity, the facility incorporates direct-to-chip liquid cooling to support next-generation AI infrastructure.

These developments highlight the growing role of liquid cooling in upgrading data center infrastructure across the Asia-Pacific region, particularly as operators address rising AI computing demands alongside energy constraints.

3. Tech Week Singapore 2026: Shaping the Next Generation of Digital Infrastructure

Tech Week Singapore 2026 will take place on September 29–30 at Marina Bay Sands Expo and Convention Centre, under the theme The Infrastructure Era. The event will bring together industry professionals from cloud computing, artificial intelligence, cybersecurity, big data, and data center sectors.

As a key event within the program, Data Centre World Asia 2026 will focus on AI-ready infrastructure, liquid cooling technologies, power and energy efficiency, fire safety, and data center operations. It will provide a platform for data center operators, infrastructure suppliers, and technology service providers to exchange insights and explore emerging industry requirements.

The event will also host OCP Southeast Asia Tech Day, featuring discussions on open hardware, AI infrastructure, and next-generation data center technologies.

As AI infrastructure continues to evolve, liquid cooling, energy management, and high-density data center deployment are expected to be among the key topics of discussion at this year's exhibition.

4. Lianli at Booth Y26: Showcasing Data Center Liquid Cooling Products

As a provider of data center liquid cooling products and solutions, Shenzhen Lianli Liquid Cooling Equipment TechnologyCo., Ltd. will showcase a range of liquid cooling products at this year's exhibition, with a focus on cooling technologies for high-density data centers and AI infrastructure.

500 kW Cabinet-Type CDU

Designed for high-density AI clusters and large-scale data center applications, the cabinet-type CDU series offers multiple cooling capacity configurations. Key features include remote monitoring, fault diagnosis, leak detection, and automatic valve shut-off, helping data center operators achieve efficient heat removal and enhanced operational safety.

65 kW Rack-Mounted CDU

Featuring a compact 4U rack-mounted design, this CDU offers a maximum cooling capacity of up to 135 kW. It supports dual power inputs and redundant pump configurations, along with precise coolant supply temperature control and multi-layer leak protection. It is designed for high-density liquid-cooled server racks.

Through a range of liquid cooling products with different specifications, Lianli aims to address the diverse requirements of data centers for cooling capacity, system reliability, and flexible deployment.

5. From Efficient Cooling to Integrated Liquid Cooling Solutions

As power densities in AI data centers continue to rise, liquid cooling is evolving beyond individual equipment-level thermal management toward integrated infrastructure solutions.

CDUs, liquid-cooled server racks, cold plates, and supporting piping systems must work together effectively to meet the demands of high power density, precise temperature control, system redundancy, and operational safety.

At Data Centre World Asia 2026, the Live Data Centre showcase will also feature key infrastructure components, including CDUs, rack-level liquid cooling systems, manifolds, piping networks, and leak detection systems. This will provide industry professionals with opportunities to explore practical liquid cooling applications and system configurations.

Lianli looks forward to engaging with data center operators, AI infrastructure providers, server manufacturers, and system integrators to exchange insights on liquid cooling requirements and explore solutions for a wide range of application scenarios.

6. Join Us in Singapore to Explore New Opportunities in AI Data Center Liquid Cooling

From the continued growth of AI computing to rising demands for energy efficiency and thermal management, liquid cooling is becoming an essential component of next-generation digital infrastructure.

On September 29–30, 2026, Shenzhen Lianli Liquid Cooling Equipment TechnologyCo., Ltd. welcomes data center professionals and partners from around the world to visit us at Data Centre World Asia 2026 in Singapore. We look forward to discussing liquid cooling technologies, product applications, and data center infrastructure solutions with you in person.

Exhibition Information

 

 

Event

Data Centre World Asia 2026

Date

September 29–30, 2026

Venue

Marina Bay Sands Expo and Convention Centre, Singapore

Exhibitor

Shenzhen Lianli Liquid Cooling Equipment TechnologyCo., Ltd.

Booth

Y26

 

We welcome you to visit Lianli at Booth Y26 and explore efficient, reliable liquid cooling technologies and AI infrastructure solutions for data centers.


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Explore the 2026 shift toward liquid cooling in AI data centers, including rising GPU power, the limits of air cooling, direct-to-chip and immersion cooling, and the role of liquid cooling in high-density thermal management and data-center energy efficiency.


Shenzhen Lianli will exhibit at Tech Week Singapore and Data Centre World Asia 2026, showcasing AI data center liquid cooling, CDUs, and next-generation thermal management solutions at Booth Y26.