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ORV3-RACK-440U OCP Open Rack V3 Liquid Cooling Ready Rack

ORV3-RACK-440U OCP Open Rack V3 liquid cooling ready rack. 440U high density, 48V bus bar, DLC-ready for AI data center and HPC clusters.

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Category: power supply

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  • Description
  • Specifications
    • Commodity name: ORV3-RACK-440U OCP Open Rack V3 Liquid Cooling Ready Rack
    • Commodity ID: ORV3

    ORV3-RACK-440U OCP Open Rack V3 liquid cooling ready rack. 440U high density, 48V bus bar, DLC-ready for AI data center and HPC clusters.

    The ORV3-RACK-440U is an OCP-certified Open Rack V3 liquid cooling ready rack built for high-power AI, HPC and dense data center deployments. Featuring a 21-inch inner width, 440U mounting space and pre-reserved CDU installation area, this rack supports rack-level direct liquid cooling. It adopts 48V Bus Bar power architecture and natively fits ORV3 hardware, while remaining compatible with traditional 19-inch EIA devices via adapter frames.

    Specifications Table

    Item

    Details

    Product Model

    ORV3-RACK-440U

    Standard Compliance

    OCP Open Rack V3 Base Spec, OCP Certified

    Total Usable Height

    440U (2112mm, 48mm per OU)

    Internal Mount Width

    21 inch

    Rack Depth

    1200 mm

    Supported Equipment

    Native ORV3 IT hardware; 19-inch EIA equipment (with adapter frame)

    Power System

    48V DC Bus Bar, rated 30kW, support hot-swappable Power Shelf

    Liquid Cooling

    DLC-Ready, reserved CDU & liquid pipeline space

    Application Scenarios

    AI data center, HPC / supercomputing center, high-density colocation


     Applications

    AI Data Centers

    Designed for high-density AI computing environments, supporting the deployment of AI servers and GPU clusters.

    GPU Computing Clusters

    Suitable for high-power GPU servers and large-scale computing clusters requiring efficient power and cooling infrastructure.

    High-Performance Computing (HPC)

    Supports high-density server deployment for scientific computing, engineering simulations, and other HPC applications.

    High-Density Data Centers

    Ideal for modern data centers requiring high-density computing, centralized power distribution, and integrated liquid cooling solutions.

     

    FAQ


    Q1: What is an OCP ORV3.0 Liquid-Cooled Server Rack?

    The OCP ORV3.0 Liquid-Cooled Server Rack is an open rack designed based on the OCP Open Rack V3 standard. Featuring a 21-inch architecture and 44U configuration, it is designed for AI servers, GPU clusters, and high-density computing applications.

    Q2: What applications is this server rack suitable for?

    This rack is suitable for AI data centers, GPU computing clusters, high-performance computing (HPC), and other high-density computing environments.

    Q3: Does the rack support liquid cooling systems?

    Yes. Depending on project requirements, the rack can be configured with liquid cooling components such as CDUs and manifolds and can be integrated into a complete liquid cooling system.

    Q4: What are the advantages of the 48V Busbar power system?

    The 48V Busbar system provides centralized power distribution, helping reduce complex internal cabling and supporting the power requirements of high-density servers and AI computing equipment.

    Q5: Is the OCP ORV3.0 rack suitable for AI and GPU servers?

    Yes. The open rack architecture is designed to support high-density computing environments, including AI servers, GPU clusters, and HPC systems. Configurations can be customized according to server specifications and project requirements.

    Q6: Is customization available?

    Yes. The rack can be configured according to customer requirements, including server deployment, power distribution, liquid cooling components, and other project-specific configurations.


    Related Products


    Build a Complete Data Center Liquid Cooling System

    The OCP ORV3.0 Liquid-Cooled Server Rack can be integrated with related liquid cooling equipment to support complete cooling solutions for AI data centers and high-density computing environments.

     

    Rack-Mounted CDU

    Provides coolant circulation and thermal management for rack-level liquid cooling systems.

    Cabinet CDU

    Designed for higher-capacity liquid cooling systems, providing centralized coolant distribution and thermal management.

    Cold Plate

    Designed for direct liquid cooling of high-power components such as CPUs and GPUs, providing efficient chip-level thermal management.

     

    Shipping & Delivery


    Professional Packaging

    Products are securely packaged to help protect equipment during transportation. Packaging solutions can be selected according to product specifications and shipping requirements.

    Flexible Shipping Options

    We support multiple international shipping methods, including sea freight, air freight, and other logistics solutions based on project requirements and destination.

    Global Delivery Support

    We provide shipping support for customers worldwide and can coordinate suitable logistics arrangements according to the destination and project schedule.

    Project-Based Delivery

    Delivery schedules are determined based on product configuration, order quantity, production requirements, and destination. Please contact our team for detailed delivery information.

     

    Need Shipping Information for Your Project?

    Contact our team for product packaging, shipping options, and delivery schedule information.

    Button:Get Shipping Information

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