Lianli Wins the “Core Innovation Award” at the 2026 Asian Industrial Technology Expo

As artificial intelligence (AI), high-performance computing (HPC), and data center infrastructure continue to evolve, computing systems are becoming increasingly powerful, with higher rack power densities driving greater demand for efficient thermal management. Against this backdrop, liquid cooling technology is emerging as a key solution for next-generation data centers, offering efficient heat transfer, precise temperature control, and opportunities to improve overall energy efficiency.

From October 27 to 29, 2026, the Shenzhen International Electronics Sourcing Show and Shenzhen International Futuristic Electronics Industry Show will take place at the Shenzhen World Exhibition & Convention Center in Bao'an, Shenzhen, China. Shenzhen Lianli Liquid Cooling Equipment Technology Co., Ltd. will participate in the exhibition to showcase its expertise in data center liquid cooling equipment, precision manufacturing, and integrated cooling solutions.

Lianli has also received the “Core Innovation Award” at the Asian Industrial Technology Expo Blue Chip Awards. This recognition reflects the company's continued commitment to technology development and product innovation, reinforcing its focus on liquid cooling technologies for high-density computing infrastructure.

Advancing Data Center Infrastructure with Liquid Cooling Technology

The rapid development of AI model training, inference workloads, and HPC applications is driving sustained growth in demand for computing capacity. As high-performance processors and graphics processing units (GPUs) become more widely deployed, server power consumption and rack power density continue to increase. Traditional air cooling systems face growing challenges in thermal performance, space utilization, and energy efficiency.

Liquid cooling is therefore becoming an increasingly important part of modern data center thermal management. By transferring heat through a circulating coolant, liquid cooling systems can remove heat more directly from high-power components and servers. System configurations can be tailored to equipment power requirements, rack architecture, and operating conditions.

For AI data centers, effective liquid cooling involves more than heat removal alone. Coolant circulation, flow distribution, pressure management, equipment compatibility, and system reliability all contribute to overall performance. Data center operators must therefore evaluate not only individual equipment specifications but also system integration capabilities, product quality, delivery schedules, and long-term maintenance requirements.

Against this evolving market landscape, Lianli continues to develop data center liquid cooling solutions covering key components, cooling equipment, and supporting systems. The company aims to provide products and solutions tailored to the requirements of different data center architectures and deployment scenarios.

A Comprehensive Liquid Cooling Product Portfolio for Data Centers

Lianli focuses on the development and manufacturing of liquid cooling equipment for data center applications. Its product portfolio covers containerized data centers, liquid-cooled server racks, cold plates, rack-mounted Coolant Distribution Units (CDUs), and in-rack CDUs, supporting a range of cooling infrastructure requirements.

Containerized Data Centers: Modular Deployment and Faster Implementation

As data center construction increasingly adopts modular and prefabricated approaches, containerized data centers offer flexibility in deployment and infrastructure integration. By coordinating equipment layout, power distribution, thermal management, and supporting systems, modular data center solutions can be configured to meet different project requirements and site conditions.

Lianli's containerized data center offerings support customers seeking integrated infrastructure configurations for flexible deployment and scalable computing capacity.

Liquid-Cooled Server Racks: Designed for High-Density Computing

Liquid-cooled server racks are an important part of the infrastructure connecting computing equipment with liquid cooling systems. As high-power servers and AI computing platforms become more prevalent, rack design must account for structural integrity, equipment installation, coolant piping, system interfaces, and service accessibility.

Lianli continues to develop rack solutions and related equipment to support the deployment requirements of high-density computing environments.

Cold Plates: Direct Heat Removal at the Component Level

Cold plates are critical heat exchangers in direct-to-chip liquid cooling systems. Coolant circulates through internal channels to remove heat from processors and other high-power components.

As chip power consumption increases, cold plate performance depends on several factors, including channel design, heat transfer efficiency, pressure drop, and sealing reliability. Proper cold plate design and system integration are essential to achieving effective thermal management in high-performance computing environments.

In-Rack CDU and In-Row CDU: Supporting Reliable Coolant Distribution

Coolant Distribution Units (CDUs) are key components of liquid cooling infrastructure. Depending on system architecture, they manage coolant circulation and distribution and may provide monitoring and control of operating parameters such as temperature, pressure, and flow rate.

Rack-mounted and in-rack CDU configurations offer different installation and integration options for data center cooling systems. Appropriate equipment selection and system design help address application-specific requirements for cooling capacity, operational reliability, and maintenance accessibility.

By developing products across key stages of the cooling infrastructure, Lianli aims to provide customers with flexible equipment options and coordinated liquid cooling solutions for data center deployment and operation.

Precision Manufacturing and In-House Development Strengthen Product Reliability

The long-term reliability of a liquid cooling system depends not only on product design but also on manufacturing processes, quality inspection, assembly procedures, and the compatibility of individual components. These factors are particularly important in data centers, where continuous operation and dependable thermal management are essential.

Lianli combines product development with precision manufacturing and continues to improve its processes for product design, manufacturing, assembly, inspection, and quality control. By aligning engineering development with practical application requirements, the company aims to deliver reliable liquid cooling equipment and supporting products.

Data center projects can vary significantly in rack configuration, equipment power, cooling architecture, installation environment, and system interfaces. Liquid cooling equipment must therefore be selected and configured according to the specific requirements of each application.

Lianli continues to strengthen its product adaptability and manufacturing capabilities to support customers throughout project implementation. The company's ongoing development efforts focus on thermal performance, operational reliability, system integration, and modular deployment, with applications across AI data centers, HPC infrastructure, and other high-heat-load computing environments.

Receiving the “Core Innovation Award” further encourages Lianli to advance product development and explore new opportunities in liquid cooling technology.

Recognized for Innovation in Liquid Cooling Technology

Lianli's recognition at the Asian Industrial Technology Expo Blue Chip Awards highlights the company's continued efforts in product development and technological innovation.

As AI infrastructure expands, data center development is moving toward higher rack densities, improved energy efficiency, and more integrated infrastructure designs. Progress in liquid cooling requires more than improvements to individual products. It also depends on collaboration among cooling equipment manufacturers, server vendors, data center operators, and system integrators to improve interoperability, standardization, and project delivery.

Lianli will continue to focus on liquid cooling equipment development and manufacturing while refining its product portfolio to address evolving application requirements. The company also looks forward to engaging with industry partners to exchange technical insights, understand emerging market needs, and explore opportunities for collaboration.

Meet Lianli in Shenzhen: Exploring the Future of Data Center Liquid Cooling

The Shenzhen International Electronics Sourcing Show and Shenzhen International Futuristic Electronics Industry Show provide a platform for product demonstrations, technical exchange, and business cooperation across the electronics and industrial technology sectors.

Lianli looks forward to connecting with data center operators, server manufacturers, system integrators, and other industry partners to discuss liquid cooling equipment selection, system integration, thermal management for high-density computing, and project implementation.

Through its participation, Lianli aims to demonstrate its capabilities in liquid cooling product development, precision manufacturing, and supporting solutions while exploring new opportunities for liquid cooling applications in next-generation data centers.

Looking ahead, Lianli will continue to invest in product development and manufacturing quality, expand its liquid cooling portfolio, and strengthen product adaptability and delivery capabilities. The company is committed to providing reliable liquid cooling products and solutions for data centers and high-density computing infrastructure worldwide.

Exhibition Information

Exhibition: Shenzhen International Electronics Sourcing Show and Shenzhen International Futuristic Electronics Industry Show

Dates: October 27–29, 2026

Venue: Shenzhen World Exhibition & Convention Center, Bao'an, Shenzhen, China

Lianli Booth: Hall 15; please confirm the final booth number before publication

Award Ceremony: October 29, 2026, 10:30 AM–12:00 PM

Ceremony Venue: Hall 15, Meeting Room 2, Shenzhen World Exhibition & Convention Center

Lianli welcomes industry partners to connect with the team and explore new opportunities in liquid cooling technology and next-generation data center infrastructure.