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NVIDIA GB200 Cold Plate Liquid Cooling Solution

A purpose-built cold plate liquid cooling infrastructure for NVIDIA GB200 NVL2 ultra-high-density compute nodes, designed to Tier 2 standards with a 7-day rapid delivery commitment. In Shenzhen's hot, humid climate, cold plate liquid cooling is the only viable thermal management path for GB200.

300 KW
Total IT load
GB200
NVL2 architecture
7 days
Rapid delivery target
Tier 2
Data center class
<1.20
Target PUE (Shenzhen)

GB200 NVL2 architecture — critical thermal context

⚡The GB200 NVL2 "1+2" configuration pairs one Grace CPU Superchip with two Blackwell GPUs, each with a TDP of 2,700 W — rack power density far exceeds conventional servers. Shenzhen's summer wet-bulb temperature regularly exceeds 28 °C, making air cooling entirely infeasible. Cold plate liquid cooling is the only effective thermal path. The liquid loop must handle ≥ 95% of total heat rejection; mechanical refrigeration (chiller) is a required component, not a backup option.
 
Cold plates (GPU / CPU)
Custom copper microchannel cold plates bonded directly to GB200 Blackwell GPUs and Grace CPUs. Supports single-GPU heat flux ≥ 500 W to handle the 2,700 W TDP per GPU.
 
NVL2 rack manifold system
Dedicated dual-path supply/return manifolds per NVL2 rack. Quick-disconnect fittings enable module-level hot-swap maintenance. Full stainless steel / copper pipework — zero-leak design.
 
Room-level CDU
N+1 redundant CDU to Tier 2 standard. Dual-pump active standby with online switchover. Plate HX isolates primary/secondary loops. At 500 KW scale: ≥ 250 KW/unit × 2, running in parallel.
 
Primary cooling (Shenzhen: chiller-led)
Shenzhen's year-round high temperatures offer minimal free-cooling hours. A water-cooled chiller is the primary cold source. Dry coolers provide limited supplemental cooling in winter only.
 
Cooling fluid
Secondary loop uses deionised water — no antifreeze required in Shenzhen. Recommended CDU supply temperature 18–22 °C; return temperature ≤ 35 °C, within GB200 cold plate inlet spec.
 
DCIM monitoring
Full-chain sensors: fluid temperature, flow rate, differential pressure, leak detection, and electrical parameters unified in a DCIM platform. Node-level thermal control and remote O&M supported.

System flow architecture

Primary cooling loop (≥ 95% heat load)

CDU supply (18–22 °C)

→

NVL2 rack manifold

→

Cold plate heat absorption (GPU×2 + CPU)

→

Return (≤ 35 °C)

→

CDU plate HX

→

Repeat

Primary-side heat rejection (Shenzhen: chiller-primary)

CDU primary warm water

→

Water-cooled chiller

→

Chilled water returns to CDU

→

Dry cooler assist in winter only

Residual heat handling (< 5%)

Rack heat leakage

→

Room air

→

Precision in-row A/C unit
Shenzhen's annual mean temperature of ~23 °C and summer peaks above 35 °C leave almost no free-cooling window. The GB200's extreme TDP makes cold plate + chiller the only architecture that guarantees year-round stable operation in this climate. Target PUE < 1.20 — still materially better than an equivalent air-cooled facility at 1.4+, driven by the liquid loop's high thermal efficiency.

 

Key technical parameters

Server architectureGB200 NVL2 
Per-GPU TDP2,700 W
Total IT load300 KW
CDU configuration≥ 150 KW/unit × 2, N+1 redundant
Pump redundancyDual-pump active standby, online switching
Cold plate materialCopper microchannel (high heat-flux rated)
Secondary coolantDeionised water (no antifreeze needed)
CDU supply temperature18 – 22 °C
CDU return temperature≤ 35 °C
Ambient range10 °C to 40 °C (Shenzhen outdoor)

7-day rapid delivery schedule

⚠️7 days is an absolute minimum timeline. Prerequisites: cold plates, CDUs, and pipework must be in stock or pre-positioned; machine room civil works, primary power, and chiller plant must be ready to connect; all teams must execute in parallel with no waiting dependencies between stages.
D1
Day 1
Design lock & stock dispatch
Confirm GB200 cold plate spec, CDU model selection, and piping drawings. Verify in-stock availability of CDU, cold plates, manifolds, and fittings. Arrange same-day dispatch to Shenzhen site.
D2
Day 2
Site survey & civil conditions check
Engineering team on-site: verify floor load capacity, chiller chilled-water interface, PDU capacity, and pipe shaft clearances. Issue site installation plan. Receive and inspect arriving equipment.
D3
Day 3
CDU placement & main pipework
CDU cabinets rigged into position. Primary-side connection to chiller chilled-water supply and return. Main supply/return headers routed and supported throughout the machine room.
D4
Day 4
NVL2 rack installation & cold plate fitting
GB200 NVL2 racks positioned. Distribution manifolds installed. Cold plates precisely aligned and mounted on each GPU and CPU. Quick-disconnect connections made. In-rack branch pipework completed.
D5
Day 5
System fill & pressure testing
Full system fill and air purge. Pressure test at 1.5× working pressure, 30-minute hold. Leak sensor verification. CDU parameter initialisation. Flow rate and differential pressure balancing across all branches.
D6
Day 6
Power-on commissioning & DCIM integration
GB200 servers powered on. Cold plate temperature distribution validation. CDU automatic control logic verified. DCIM platform connected. Alert thresholds configured and tested.
D7
Day 7
Full-load acceptance & handover
500 KW full-load burn-in test. PUE measured and recorded. All parameters — fluid temperature, flow rate, differential pressure — verified against acceptance criteria. Documentation archived. Formal handover to client operations team.

Tier 2 compliance · certifications

N+1 redundancy Dual supply loops Online maintainability Full-chain leak detection Node-level thermal control RoHS CE UL CCS 7-day rapid delivery Shenzhen hot-humid climate rated Domestic tier-1 components

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